Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9462736 | Composition and methods of forming solder bump and flip chip using the same | Yong Sung EOM, Jong Tae Moon, KeonSoo JANG | 2016-10-04 |
SO
Sangwon OH
Overall (2016): #238,820 of 481,213Top 50%
1
Patents 2016