Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9462736 | Composition and methods of forming solder bump and flip chip using the same | Yong Sung EOM, Jong Tae Moon, Sangwon OH | 2016-10-04 |
KJ
KeonSoo JANG
Overall (2016): #330,693 of 481,213Top 70%
1
Patents 2016