Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9455214 | Wafer frontside-backside through silicon via | Jeffrey C. Maling, Anthony K. Stamper, Daniel S. Vanslette | 2016-09-27 |
| 9443764 | Method of eliminating poor reveal of through silicon vias | Jeffrey C. Maling, Anthony K. Stamper, Daniel S. Vanslette | 2016-09-13 |