Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9462691 | Enhanced ball grid array | — | 2016-10-04 |
| 9418965 | Embedded interposer with through-hole vias | Zhe Li | 2016-08-16 |
| 9401287 | Methods for packaging integrated circuits | Loon Kwang Tan, Ping Chet Tan | 2016-07-26 |
| 9401330 | IC package with non-uniform dielectric layer thickness | Xiaohong Jiang, Hong Shi, Hui Liu | 2016-07-26 |