Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425149 | Integrated circuit package routing with reduced crosstalk | Jianming Huang, Hong Shi, Jianmin Zhang | 2016-08-23 |
| 9401330 | IC package with non-uniform dielectric layer thickness | Hong Shi, Hui Liu, Yuanlin Xie | 2016-07-26 |
| 9331370 | Multilayer integrated circuit packages with localized air structures | — | 2016-05-03 |
| 9245835 | Integrated circuit package with reduced pad capacitance | Hong Shi | 2016-01-26 |