| 9433077 |
Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section |
Dominic Gschwend, Keiji Matsumoto, Stefano S. Oggioni, Gerd Schlottig, Timo J. Tick +1 more |
2016-08-30 |
| 9406563 |
Integrated device with defined heat flow |
Jens Hofrichter |
2016-08-02 |
| 9397042 |
Integrated helical multi-layer inductor structures |
Michele Castriotta, Rachel Gordin, Stefano S. Oggioni, Gerd Schlottig |
2016-07-19 |
| 9389362 |
Adaptive optical interconnection of components of an electro-optical circuit |
Antonio La Porta, Bert Jan Offrein, Jonas R. Weiss |
2016-07-12 |
| 9337122 |
Transferring heat through an optical layer of integrated circuitry |
Harry Barowski, Roger F. Dangel, Hubert Harrer, Andreas Huber, Norbert M. Meier +5 more |
2016-05-10 |
| 9313921 |
Chip stack structures that implement two-phase cooling with radial flow |
Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang |
2016-04-12 |
| 9252072 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly |
Kerry Bernstein, Bruno Michel |
2016-02-02 |
| 9252071 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly |
Kerry Bernstein, Bruno Michel |
2016-02-02 |
| 9230830 |
Bridging arrangement and method for manufacturing a bridging arrangement |
Javier V. Goicochea, Cyrill Kuemin, Walter Riess, Heiko Wolf |
2016-01-05 |
| 9230832 |
Method for manufacturing a filled cavity between a first and a second surface |
Stephan Paredes, Gerd Schlottig, Heiko Wolf |
2016-01-05 |
