Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515049 | Flexibly-wrapped integrated circuit die | Michael P. Skinner, Hans-Joachim Barth, Peter Baumgartner, Harald Gossner | 2016-12-06 |
| 9397019 | Integrated circuit package configurations to reduce stiffness | Sonja Koller, Thorsten Meyer, Georg Seidemann, Christian Geissler, Andreas Wolter | 2016-07-19 |
| 9385105 | Semiconductor devices | Thorsten Meyer, Gerald Ofner, Bernd Waidhas, Hans-Joachim Barth, Reinhard Golly +2 more | 2016-07-05 |
| 9373588 | Stacked microelectronic dice embedded in a microelectronic substrate | Reinhard Mahnkopf, Wolfgang Molzer, Bernd Memmler, Edmund Goetz, Hans-Joachim Barth +1 more | 2016-06-21 |
| 9368461 | Contact pads for integrated circuit packages | Georg Seidemann, Sonja Koller, Stephan Stoeckl, Shubhada H. Sahasrabudhe, Sandeep B. Sane | 2016-06-14 |
| 9343389 | Magnetic contacts | Michael P. Skinner, Teodora Ossiander, Georg Seidemann | 2016-05-17 |
| 9312198 | Chip package-in-package and method thereof | Thorsten Meyer, Andreas Wolter | 2016-04-12 |