SD

Shankar Devasenathipathy

IN Intel: 2 patents #1,153 of 5,207Top 25%
Overall (2016): #99,836 of 481,213Top 25%
2
Patents 2016

Issued Patents 2016

Patent #TitleCo-InventorsDate
9434029 High performance transient uniform cooling solution for thermal compression bonding process Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Steven B. Roach, Ioan Sauciuc +3 more 2016-09-06
9282650 Thermal compression bonding process cooling manifold Hemanth K. Dhavaleswarapu, Zhihua Li, Joseph B. Petrini, Steven B. Roach, George Kostiew +1 more 2016-03-08