HD

Hemanth K. Dhavaleswarapu

IN Intel: 2 patents #1,153 of 5,207Top 25%
Overall (2016): #139,449 of 481,213Top 30%
2
Patents 2016

Issued Patents 2016

Patent #TitleCo-InventorsDate
9434029 High performance transient uniform cooling solution for thermal compression bonding process Zhihua Li, Joseph B. Petrini, Shankar Devasenathipathy, Steven B. Roach, Ioan Sauciuc +3 more 2016-09-06
9282650 Thermal compression bonding process cooling manifold Zhihua Li, Joseph B. Petrini, Steven B. Roach, Shankar Devasenathipathy, George Kostiew +1 more 2016-03-08