Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9434029 | High performance transient uniform cooling solution for thermal compression bonding process | Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Steven B. Roach, Ioan Sauciuc +3 more | 2016-09-06 | $9,244,000 |
| 9282650 | Thermal compression bonding process cooling manifold | Hemanth K. Dhavaleswarapu, Zhihua Li, Joseph B. Petrini, Steven B. Roach, George Kostiew +1 more | 2016-03-08 | $14,558,000 |