Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9434029 | High performance transient uniform cooling solution for thermal compression bonding process | Zhihua Li, Hemanth K. Dhavaleswarapu, Shankar Devasenathipathy, Steven B. Roach, Ioan Sauciuc +3 more | 2016-09-06 |
| 9282650 | Thermal compression bonding process cooling manifold | Hemanth K. Dhavaleswarapu, Zhihua Li, Steven B. Roach, Shankar Devasenathipathy, George Kostiew +1 more | 2016-03-08 |