SM

SeongHun Mun

SC Stats Chippac: 1 patents #56 of 121Top 50%
Overall (2016): #233,911 of 481,213Top 50%
1
Patents 2016

Issued Patents 2016

Patent #TitleCo-InventorsDate
9331007 Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages InSang Yoon, Flynn Carson, Il Kwon Shim 2016-05-03