Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490195 | Wafer-level flipped die stacks with leadframes or metal foil interconnects | Ashok S. Prabhu, Rajesh Katkar | 2016-11-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490195 | Wafer-level flipped die stacks with leadframes or metal foil interconnects | Ashok S. Prabhu, Rajesh Katkar | 2016-11-08 |