Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418877 | Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layers | Shiqun Gu, Dong Wook Kim, Jae Sik Lee | 2016-08-16 |
| 9285418 | Method and apparatus for characterizing thermal marginality in an integrated circuit | Tapan Jyoti Chakraborty, Rajamani Sethuram | 2016-03-15 |