Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520306 | Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion | Geraldine Tsui Yee Lin, Walter de Munnik, Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang +1 more | 2016-12-13 |
| 9449903 | Ball grid array package with improved thermal characteristics | Ming Wang Sze, Kwok Cheung Tsang, Wing Keung Lam, Wai Kit Tam | 2016-09-20 |
| 9318457 | Methods of fabricating semiconductor chip solder structures | Roden R. Topacio | 2016-04-19 |