Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520306 | Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion | Walter de Munnik, Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang, Chun Ho Fan +1 more | 2016-12-13 |