Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520306 | Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion | Geraldine Tsui Yee Lin, Walter de Munnik, Kin Pui Kwan, Wing Him Lau, Chun Ho Fan +1 more | 2016-12-13 |
| 9449903 | Ball grid array package with improved thermal characteristics | Neil McLellan, Ming Wang Sze, Wing Keung Lam, Wai Kit Tam | 2016-09-20 |
| 9373576 | Flip chip pad geometry for an IC package substrate | — | 2016-06-21 |