Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520306 | Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion | Geraldine Tsui Yee Lin, Walter de Munnik, Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang +1 more | 2016-12-13 |
| 9484241 | Device for holding multiple semiconductor devices during thermocompression bonding and method of bonding | Man Chan | 2016-11-01 |
| 9257370 | Cavity package with pre-molded cavity leadframe | — | 2016-02-09 |