Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9283641 | Flux materials for heated solder placement and associated techniques and configurations | Rajen S. Sidhu, Wei Tan | 2016-03-15 |
| 9257405 | Multi-solder techniques and configurations for integrated circuit package assembly | Rajen S. Sidhu, Wei Hu, Carl Deppisch | 2016-02-09 |