Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9499399 | Method for forming MEMS structure with an etch stop layer buried within inter-dielectric layer | Li-Che Chen, Te-Yuan Wu, Chia-Huei Lin, Hui-Min Wu, Kuan-Yu Wang +1 more | 2016-11-22 |