Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520333 | Wafer level package and fabrication method thereof | Shing-Yih Shih, Neng-Tai Shih | 2016-12-13 |
| 9496358 | Semiconductor device and fabrication method therefor | Tzung-Han Lee, Yaw Wen Hu, Neng-Tai Shih, Heng Hao Hsu, Yu Jing Chang | 2016-11-15 |