| 9530691 |
Methods, apparatus and system for forming a dielectric field for dual orientation self aligned vias |
Xunyuan Zhang |
2016-12-27 |
| 9520321 |
Integrated circuits and methods for fabricating integrated circuits with self-aligned vias |
Sean Xuan Lin |
2016-12-13 |
| 9466530 |
Methods of forming an improved via to contact interface by selective formation of a metal silicide capping layer |
Xunyuan Zhang, Tibor Bolom |
2016-10-11 |
| 9435947 |
Integration of optical components in integrated circuits by separating two substrates with an insulation layer |
— |
2016-09-06 |
| 9431294 |
Methods of producing integrated circuits with an air gap |
Ming He, Roderick A. Augur, Craig Child, Larry Zhao |
2016-08-30 |
| 9349631 |
Method for defining an isolation region(s) of a semiconductor structure |
— |
2016-05-24 |
| 9343408 |
Method to etch Cu/Ta/TaN selectively using dilute aqueous HF/H2SO4 solution |
Anh Duong |
2016-05-17 |
| 9318436 |
Copper based nitride liner passivation layers for conductive copper structures |
Xunyuan Zhang, Larry Zhao, Ming He, Sean Xuan Lin, John A. Iacoponi |
2016-04-19 |
