Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230873 | Semiconductor package resin composition and usage method thereof | Kohichiro Kawate, Hiroko Akiyama, Naota Sugiyama, Brant U. Kolb | 2016-01-05 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230873 | Semiconductor package resin composition and usage method thereof | Kohichiro Kawate, Hiroko Akiyama, Naota Sugiyama, Brant U. Kolb | 2016-01-05 |