Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281255 | Underfill composition and semiconductor device and manufacturing method thereof | — | 2016-03-08 |
| 9230873 | Semiconductor package resin composition and usage method thereof | Hiroko Akiyama, Naota Sugiyama, Brant U. Kolb, Eric G. Larson | 2016-01-05 |