Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9230873 | Semiconductor package resin composition and usage method thereof | Kohichiro Kawate, Hiroko Akiyama, Naota Sugiyama, Brant U. Kolb | 2016-01-05 | $17,182,000 |