Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9333723 | Adhesive composition | Yorinobu Takamatsu, Yoshiteru Kakinuma | 2016-05-10 |
| 9230873 | Semiconductor package resin composition and usage method thereof | Kohichiro Kawate, Naota Sugiyama, Brant U. Kolb, Eric G. Larson | 2016-01-05 |