Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515006 | 3D device packaging using through-substrate posts | Douglas M. Reber, Mehul D. Shroff | 2016-12-06 |
| 9508701 | 3D device packaging using through-substrate pillars | Douglas M. Reber, Mehul D. Shroff | 2016-11-29 |
| 9508702 | 3D device packaging using through-substrate posts | Douglas M. Reber, Mehul D. Shroff | 2016-11-29 |
| 9455220 | Apparatus and method for placing stressors on interconnects within an integrated circuit device to manage electromigration failures | Mehul D. Shroff, Douglas M. Reber | 2016-09-27 |
| 9445050 | Teleconferencing environment having auditory and visual cues | Douglas M. Reber | 2016-09-13 |
| 9443804 | Capping layer interface interruption for stress migration mitigation | Mehul D. Shroff, Douglas M. Reber | 2016-09-13 |
| 9318409 | Integrated circuit heater for reducing stress in the integrated circuit material and chip leads of the integrated circuit, and for optimizing performance of devices of the integrated circuit | Douglas M. Reber, Mehul D. Shroff | 2016-04-19 |
| 9245817 | Semiconductor device with embedded heat spreading | Douglas M. Reber, Mehul D. Shroff | 2016-01-26 |
| 9236344 | Thin beam deposited fuse | Douglas M. Reber, Mehul D. Shroff | 2016-01-12 |