Issued Patents 2016
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515006 | 3D device packaging using through-substrate posts | Mehul D. Shroff, Edward O. Travis | 2016-12-06 |
| 9508702 | 3D device packaging using through-substrate posts | Mehul D. Shroff, Edward O. Travis | 2016-11-29 |
| 9508701 | 3D device packaging using through-substrate pillars | Mehul D. Shroff, Edward O. Travis | 2016-11-29 |
| 9466569 | Though-substrate vias (TSVs) and method therefor | Mehul D. Shroff | 2016-10-11 |
| 9455220 | Apparatus and method for placing stressors on interconnects within an integrated circuit device to manage electromigration failures | Mehul D. Shroff, Edward O. Travis | 2016-09-27 |
| 9445050 | Teleconferencing environment having auditory and visual cues | Edward O. Travis | 2016-09-13 |
| 9443804 | Capping layer interface interruption for stress migration mitigation | Mehul D. Shroff, Edward O. Travis | 2016-09-13 |
| 9318409 | Integrated circuit heater for reducing stress in the integrated circuit material and chip leads of the integrated circuit, and for optimizing performance of devices of the integrated circuit | Mehul D. Shroff, Edward O. Travis | 2016-04-19 |
| 9245817 | Semiconductor device with embedded heat spreading | Edward O. Travis, Mehul D. Shroff | 2016-01-26 |
| 9236344 | Thin beam deposited fuse | Mehul D. Shroff, Edward O. Travis | 2016-01-12 |