Issued Patents 2016
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515006 | 3D device packaging using through-substrate posts | Douglas M. Reber, Edward O. Travis | 2016-12-06 |
| 9508702 | 3D device packaging using through-substrate posts | Douglas M. Reber, Edward O. Travis | 2016-11-29 |
| 9508701 | 3D device packaging using through-substrate pillars | Douglas M. Reber, Edward O. Travis | 2016-11-29 |
| 9472418 | Method for forming a split-gate device | Mark D. Hall | 2016-10-18 |
| 9466569 | Though-substrate vias (TSVs) and method therefor | Douglas M. Reber | 2016-10-11 |
| 9455220 | Apparatus and method for placing stressors on interconnects within an integrated circuit device to manage electromigration failures | Douglas M. Reber, Edward O. Travis | 2016-09-27 |
| 9443041 | Simulation system and method for testing a simulation of a device against one or more violation rules | Peter Abramowitz, Xavier Hours | 2016-09-13 |
| 9443804 | Capping layer interface interruption for stress migration mitigation | Douglas M. Reber, Edward O. Travis | 2016-09-13 |
| 9424379 | Simulation system and method for testing a simulation of a device against one or more violation rules | Xavier Hours, Pascal Caunegre, Christophe Oger | 2016-08-23 |
| 9318409 | Integrated circuit heater for reducing stress in the integrated circuit material and chip leads of the integrated circuit, and for optimizing performance of devices of the integrated circuit | Douglas M. Reber, Edward O. Travis | 2016-04-19 |
| 9263441 | Implant for performance enhancement of selected transistors in an integrated circuit | William F. Johnstone, Chad Weintraub | 2016-02-16 |
| 9252152 | Method for forming a split-gate device | Mark D. Hall | 2016-02-02 |
| 9245817 | Semiconductor device with embedded heat spreading | Edward O. Travis, Douglas M. Reber | 2016-01-26 |
| 9245086 | Techniques for electromigration stress mitigation in interconnects of an integrated circuit design | Ertugrul Demircan | 2016-01-26 |
| 9236344 | Thin beam deposited fuse | Douglas M. Reber, Edward O. Travis | 2016-01-12 |
| 9231077 | Method of making a logic transistor and non-volatile memory (NVM) cell | Mark D. Hall | 2016-01-05 |