Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496146 | Method for forming through-base wafer vias | Yuzhuo Li, Changxue Wang | 2016-11-15 |
| 9255214 | Chemical mechanical polishing (CMP) composition comprising inorganic particles and polymer particles | Michael Lauter, Vijay Immanuel Raman, Yuzhuo Li, Shyam Sundar Venkataraman | 2016-02-09 |