Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478499 | Semiconductor package structure and method for manufacturing the same | — | 2016-10-25 |
| 9466560 | Interposer fabricating process and wafer packaging structure | — | 2016-10-11 |
| 9437491 | Method of forming chip with through silicon via electrode | Ming-Tse Lin, Chu-Fu Lin, Yung-Chang Lin | 2016-09-06 |
| 9412686 | Interposer structure and manufacturing method thereof | Ming-Tse Lin, Kuei-Sheng Wu | 2016-08-09 |
| 9343359 | Integrated structure and method for fabricating the same | Chun-Hung Chen, Ming-Tse Lin, Yung-Chang Lin | 2016-05-17 |
| 9287173 | Through silicon via and process thereof | Chun-Hung Chen, Ming-Tse Lin, Yung-Chang Lin | 2016-03-15 |
| 9275933 | Semiconductor device | Yung-Chang Lin | 2016-03-01 |
| 9269645 | Fan-out wafer level package | Chu-Fu Lin, Kuo-Ming Chen | 2016-02-23 |