Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9474162 | Circuit substrate and method of manufacturing same | Lan Chu Tan | 2016-10-18 |
| 9437492 | Substrate for alternative semiconductor die configurations | Kai Yun Yow, Lan Chu Tan | 2016-09-06 |
| 9401345 | Semiconductor device package with organic interposer | Navas Khan Oratti Kalandar, Lan Chu Tan | 2016-07-26 |
| 9287236 | Flexible packaged integrated circuit | Teck Beng Lau, Chin Teck Siong | 2016-03-15 |
| 9269659 | Interposer with overmolded vias | Lan Chu Tan | 2016-02-23 |