Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9474162 | Circuit substrate and method of manufacturing same | Chee Seng Foong | 2016-10-18 |
| 9437492 | Substrate for alternative semiconductor die configurations | Kai Yun Yow, Chee Seng Foong | 2016-09-06 |
| 9401345 | Semiconductor device package with organic interposer | Chee Seng Foong, Navas Khan Oratti Kalandar | 2016-07-26 |
| 9297713 | Pressure sensor device with through silicon via | Wai Yew Lo | 2016-03-29 |
| 9269659 | Interposer with overmolded vias | Chee Seng Foong | 2016-02-23 |