Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502372 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li +4 more | 2016-11-22 |
| 9471550 | Method and apparatus for document conversion with font metrics adjustment for format compatibility | Jonathan Boutelle, Kapil Gupta, Michael Brown, Christopher S. Ahlers, Jeba Singh Emmanuel +1 more | 2016-10-18 |