Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397018 | Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Manfred Mengel +2 more | 2016-07-19 |
| 9275926 | Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip | Andreas Grassmann, Frank Winter, Ottmar Geitner, Alexander Schwarz, Alexander Herbrandt +2 more | 2016-03-01 |