Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9275926 | Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip | Wolfram Hable, Andreas Grassmann, Frank Winter, Ottmar Geitner, Alexander Herbrandt +2 more | 2016-03-01 |