Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437513 | Electrically insulating thermal interface on the discontinuity of an encapsulation structure | Edward Fuergut | 2016-09-06 |
| 9397018 | Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Wolfram Hable +2 more | 2016-07-19 |
| 9385111 | Electronic component with electronic chip between redistribution structure and mounting structure | Edward Fürgut, Ralf Otremba, Jürgen Högerl | 2016-07-05 |
| 9318473 | Semiconductor device including a polymer disposed on a carrier | Joachim Mahler, Khalil Hosseini, Edward Fuergut | 2016-04-19 |
| 9313898 | Low viscosity polymeric printing solutions and electronic components bearing polyimide based upon the low viscosity polymeric printing solutions | Joachim Mahler | 2016-04-12 |
| 9313897 | Method for electrophoretically depositing a film on an electronic assembly | Joachim Mahler, Khalil Hosseini, Franz-Peter Kalz | 2016-04-12 |
| 9245868 | Method for manufacturing a chip package | Holger Torwesten | 2016-01-26 |