Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496193 | Semiconductor chip with structured sidewalls | Michael Roesner, Martin Zgaga, Martin Sporn, Tobias Schmidt | 2016-11-15 |
| 9490103 | Separation of chips on a substrate | Manfred Engelhardt, Markus Zundel, Hubert Maier | 2016-11-08 |
| 9455192 | Kerf preparation for backside metallization | Michael Roesner, Manfred Engelhardt, Johann Schmid, Joachim Hirschler | 2016-09-27 |
| 9449928 | Layer arrangement | Joachim Hirschler | 2016-09-20 |
| 9449876 | Singulation of semiconductor dies with contact metallization by electrical discharge machining | Michael Roesner, Manfred Schneegans | 2016-09-20 |
| 9293371 | Method for processing a semiconductor workpiece with metallization | Anja Reitmeier, Hermann Wendt, Thomas Fischer, Bernhard Weidgans, Tobias Schmidt +1 more | 2016-03-22 |
| 9257342 | Methods of singulating substrates to form semiconductor devices using dummy material | Martin Zgaga, Markus Kahn, Guenter Denifl | 2016-02-09 |