Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496193 | Semiconductor chip with structured sidewalls | Gudrun Stranzl, Martin Zgaga, Martin Sporn, Tobias Schmidt | 2016-11-15 |
| 9455192 | Kerf preparation for backside metallization | Manfred Engelhardt, Johann Schmid, Gudrun Stranzl, Joachim Hirschler | 2016-09-27 |
| 9449876 | Singulation of semiconductor dies with contact metallization by electrical discharge machining | Gudrun Stranzl, Manfred Schneegans | 2016-09-20 |
| 9368436 | Source down semiconductor devices and methods of formation thereof | Manfred Schneegans, Andreas Meiser, Martin Mischitz, Michael Pinczolits | 2016-06-14 |