Issued Patents 2016
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9523432 | Air valve for electronics enclosures | William J. Anderl, Bret P. Elison, Phillip V. Mann, Arden L. Moore | 2016-12-20 |
| 9508614 | Alignment of three dimensional integrated circuit components | Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell, Karl Stathakis | 2016-11-29 |
| 9494752 | Dual optical and electrical LGA contact | Phillip V. Mann, Kevin M. O'Connell, Karl Stathakis | 2016-11-15 |
| 9482349 | Air valve for electronics enclosures | William J. Anderl, Bret P. Elison, Phillip V. Mann, Arden L. Moore | 2016-11-01 |
| 9482833 | Light pipe connector apparatus | Phillip V. Mann, Kevin M. O'Connell, Karl Stathakis, Kory W. Weckman | 2016-11-01 |
| 9414527 | Thermal spreading for an externally pluggable electronic module | Phillip V. Mann, Kevin M. O'Connell, Karl Stathakis | 2016-08-09 |
| 9414528 | Thermal spreading for an externally pluggable electronic module | Phillip V. Mann, Kevin M. O'Connell, Karl Stathakis | 2016-08-09 |
| 9414526 | Cooling apparatus with dynamic load adjustment | Phillip V. Mann, Kevin M. O'Connell | 2016-08-09 |
| 9392731 | Cooling apparatus with dynamic load adjustment | Phillip V. Mann, Kevin M. O'Connell | 2016-07-12 |
| 9389379 | Dual optical and electrical LGA contact | Phillip V. Mann, Kevin M. O'Connell, Karl Stathakis | 2016-07-12 |
| 9338885 | Ball grid array rework | Eric V. Kline | 2016-05-10 |
| 9332639 | Ball grid array rework | Eric V. Kline | 2016-05-03 |
| 9326386 | Computer system component bay | Bret P. Elison, Phillip V. Mann, Arden L. Moore | 2016-04-26 |
| 9301430 | Electronic module with laterally-conducting heat distributor layer | Kory W. Weckman | 2016-03-29 |
| 9299686 | Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars | Phillip V. Mann, Kevin M. O'Connell, Karl Stathakis | 2016-03-29 |
| 9299591 | Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars | Phillip V. Mann, Kevin M. O'Connell, Karl Stathakis | 2016-03-29 |
| 9277677 | Cooling an electronic device using a thermally conductive loop | Bret P. Elison, Phillip V. Mann, Arden L. Moore | 2016-03-01 |
| 9265179 | Continuous loop cooling for an electronic device | Bret P. Elison, Phillip V. Mann, Arden L. Moore | 2016-02-16 |
| 9257359 | System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks | Joseph Kuczynski, Kevin A. Splittstoesser, Timothy J. Tofil | 2016-02-09 |
| 9252525 | Sealing connector to mitigate corrosion | Phillip V. Mann, Mark D. Plucinski, Sandra J. Shirk/Heath | 2016-02-02 |
| 9247636 | Area array device connection structures with complimentary warp characteristics | Mark K. Hoffmeyer, Amanda E. Mikhail | 2016-01-26 |
| 9245813 | Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance | Gerald K. Bartley, Charles L. Johnson, John E. Kelly, III, Joseph Kuczynski, David R. Motschman +2 more | 2016-01-26 |