| 9523432 |
Air valve for electronics enclosures |
William J. Anderl, Bret P. Elison, Phillip V. Mann, Arden L. Moore |
2016-12-20 |
| 9508614 |
Alignment of three dimensional integrated circuit components |
Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell, Karl Stathakis |
2016-11-29 |
| 9494752 |
Dual optical and electrical LGA contact |
Phillip V. Mann, Kevin M. O'Connell, Karl Stathakis |
2016-11-15 |
| 9482349 |
Air valve for electronics enclosures |
William J. Anderl, Bret P. Elison, Phillip V. Mann, Arden L. Moore |
2016-11-01 |
| 9482833 |
Light pipe connector apparatus |
Phillip V. Mann, Kevin M. O'Connell, Karl Stathakis, Kory W. Weckman |
2016-11-01 |
| 9414527 |
Thermal spreading for an externally pluggable electronic module |
Phillip V. Mann, Kevin M. O'Connell, Karl Stathakis |
2016-08-09 |
| 9414528 |
Thermal spreading for an externally pluggable electronic module |
Phillip V. Mann, Kevin M. O'Connell, Karl Stathakis |
2016-08-09 |
| 9414526 |
Cooling apparatus with dynamic load adjustment |
Phillip V. Mann, Kevin M. O'Connell |
2016-08-09 |
| 9392731 |
Cooling apparatus with dynamic load adjustment |
Phillip V. Mann, Kevin M. O'Connell |
2016-07-12 |
| 9389379 |
Dual optical and electrical LGA contact |
Phillip V. Mann, Kevin M. O'Connell, Karl Stathakis |
2016-07-12 |
| 9338885 |
Ball grid array rework |
Eric V. Kline |
2016-05-10 |
| 9332639 |
Ball grid array rework |
Eric V. Kline |
2016-05-03 |
| 9326386 |
Computer system component bay |
Bret P. Elison, Phillip V. Mann, Arden L. Moore |
2016-04-26 |
| 9301430 |
Electronic module with laterally-conducting heat distributor layer |
Kory W. Weckman |
2016-03-29 |
| 9299686 |
Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars |
Phillip V. Mann, Kevin M. O'Connell, Karl Stathakis |
2016-03-29 |
| 9299591 |
Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars |
Phillip V. Mann, Kevin M. O'Connell, Karl Stathakis |
2016-03-29 |
| 9277677 |
Cooling an electronic device using a thermally conductive loop |
Bret P. Elison, Phillip V. Mann, Arden L. Moore |
2016-03-01 |
| 9265179 |
Continuous loop cooling for an electronic device |
Bret P. Elison, Phillip V. Mann, Arden L. Moore |
2016-02-16 |
| 9257359 |
System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks |
Joseph Kuczynski, Kevin A. Splittstoesser, Timothy J. Tofil |
2016-02-09 |
| 9252525 |
Sealing connector to mitigate corrosion |
Phillip V. Mann, Mark D. Plucinski, Sandra J. Shirk/Heath |
2016-02-02 |
| 9247636 |
Area array device connection structures with complimentary warp characteristics |
Mark K. Hoffmeyer, Amanda E. Mikhail |
2016-01-26 |
| 9245813 |
Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance |
Gerald K. Bartley, Charles L. Johnson, John E. Kelly, III, Joseph Kuczynski, David R. Motschman +2 more |
2016-01-26 |
