| 9508614 |
Alignment of three dimensional integrated circuit components |
Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha |
2016-11-29 |
| 9494752 |
Dual optical and electrical LGA contact |
Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha |
2016-11-15 |
| 9482833 |
Light pipe connector apparatus |
Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha, Kory W. Weckman |
2016-11-01 |
| 9414528 |
Thermal spreading for an externally pluggable electronic module |
Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha |
2016-08-09 |
| 9414527 |
Thermal spreading for an externally pluggable electronic module |
Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha |
2016-08-09 |
| 9389379 |
Dual optical and electrical LGA contact |
Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha |
2016-07-12 |
| 9299591 |
Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars |
Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha |
2016-03-29 |
| 9299686 |
Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars |
Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha |
2016-03-29 |
