| 9515401 |
Elastomeric electrical connector structure joining two hardware planes at right angles to each other |
Darryl J. Becker, Matthew S. Doyle, Mark J. Jeanson, Mark O. Maxson |
2016-12-06 |
| 9495498 |
Universal inter-layer interconnect for multi-layer semiconductor stacks |
Russell D. Hoover, Charles L. Johnson, Steven Paul VanderWiel, Patrick R. Varekamp |
2016-11-15 |
| 9488690 |
Residual material detection in backdrilled stubs |
Darryl J. Becker, Matthew S. Doyle, Philip Raymond Germann, Mark O. Maxson |
2016-11-08 |
| 9453863 |
Implementing frequency spectrum analysis using causality Hilbert Transform results of VNA-generated S-parameter model information |
Matthew S. Doyle, Richard Ericson, Wesley D. Martin, George Russell Zettles, IV |
2016-09-27 |
| 9438606 |
Environmental-based location monitoring |
Darryl J. Becker, Matthew S. Doyle, Mark O. Maxson |
2016-09-06 |
| 9341670 |
Residual material detection in backdrilled stubs |
Darryl J. Becker, Matthew S. Doyle, Philip Raymond Germann, Mark O. Maxson |
2016-05-17 |
| 9312199 |
Intelligent chip placement within a three-dimensional chip stack |
Darryl J. Becker, Philip Raymond Germann, William Paul Hovis |
2016-04-12 |
| 9310827 |
Multiple active vertically aligned cores for three-dimensional chip stack |
Darryl J. Becker, William Paul Hovis |
2016-04-12 |
| 9281261 |
Intelligent chip placement within a three-dimensional chip stack |
Darryl J. Becker, Philip Raymond Germann, William Paul Hovis |
2016-03-08 |
| 9265155 |
Flexible rework device |
David J. Braun, John R. Dangler, Matthew S. Doyle, Thomas D. Kidd |
2016-02-16 |
| 9245813 |
Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance |
Charles L. Johnson, John E. Kelly, III, Joseph Kuczynski, David R. Motschman, Arvind K. Sinha +2 more |
2016-01-26 |
