Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508652 | Direct IC-to-package wafer level packaging with integrated thermal heat spreaders | Florian G. Herrault, Alexandros Margomenos | 2016-11-29 |
| 9385083 | Wafer-level die to package and die to die interconnects suspended over integrated heat sinks | Florian G. Herrault, Alexandros Margomenos, Miroslav Micovic | 2016-07-05 |
| 9337124 | Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafers | Florian G. Herrault, Alexandros Margomenos, Miroslav Micovic, Eric M. Prophet | 2016-05-10 |