Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508652 | Direct IC-to-package wafer level packaging with integrated thermal heat spreaders | Florian G. Herrault, Melanie S. Yajima | 2016-11-29 |
| 9496197 | Near junction cooling for GaN devices | Miroslav Micovic, Keisuke Shinohara, Andrea Corrion | 2016-11-15 |
| 9385083 | Wafer-level die to package and die to die interconnects suspended over integrated heat sinks | Florian G. Herrault, Melanie S. Yajima, Miroslav Micovic | 2016-07-05 |
| 9379680 | Systems, methods, and apparatus for a power amplifier module | Miroslav Micovic, Ara K. Kurdoghlian, Ross Bowen | 2016-06-28 |
| 9337124 | Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafers | Florian G. Herrault, Miroslav Micovic, Melanie S. Yajima, Eric M. Prophet | 2016-05-10 |
| 9331735 | GaN based active cancellation circuit for high power simultaneous transmit and receive systems | Miroslav Micovic, Ara K. Kurdoghlian | 2016-05-03 |
| 9276529 | High performance GaN operational amplifier with wide bandwidth and high dynamic range | David F. Brown, Miroslav Micovic, Ara K. Kurdoghlian | 2016-03-01 |