Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9337124 | Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafers | Florian G. Herrault, Alexandros Margomenos, Miroslav Micovic, Melanie S. Yajima | 2016-05-10 |