Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9412899 | Method of stress induced cleaving of semiconductor devices | Scott Brad Herner, Linda Romano, Martin F. Schubert | 2016-08-09 |
| 9368672 | Removal of 3D semiconductor structures by dry etching | Cynthia Lemay | 2016-06-14 |
| 9287468 | LED submount with integrated interconnects | Scott Brad Herner, Linda Romano, Martin F. Schubert | 2016-03-15 |