Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9462694 | Spacer layer for embedding semiconductor die | Junrong Yan, Weili Wang, Li-Ping Wang, Pradeep Rai, Jianbin Gu +1 more | 2016-10-04 |
| 9418908 | Wafer processing method | Makoto Tanaka, Sax Liao | 2016-08-16 |