Christopher M. Scanlan — 10 Patents at Deca Technologies

Issued Patents 2016

Showing 1–10 of 10 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9520364	Front side package-level serialization for packages comprising unique identifiers	Craig Bishop, Sabbas A. Daniel	2016-12-13
9520331	Adaptive patterning for panelized packaging	Timothy L. Olson	2016-12-13
9502397	3D interconnect component for fully molded packages	—	2016-11-22
9464362	Magnetically sealed wafer plating jig system and method	Ferdinand Aldas, Kenneth C. Blaisdell, Cheryl R. Abanes	2016-10-11
9466545	Semiconductor package in package	Christopher J. Berry	2016-10-11	$11,721,000
9418905	Adaptive patterning for panelized packaging	Timothy L. Olson	2016-08-16
9401313	Automated optical inspection of unit specific patterning	Craig Bishop, Vaibhav Joga Singh Bora, Timothy L. Olson	2016-07-26
9397069	Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping	Craig Bishop	2016-07-19
9337086	Die up fully molded fan-out wafer level packaging	—	2016-05-10
9269622	Semiconductor device and method of land grid array packaging with bussing lines	Timothy L. Olson	2016-02-23