Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9494178 | Methods for bonding substrates using liquid adhesive | Cyrus Y. Liu, Kuo-Hua Sung, Silvio Grespan | 2016-11-15 |
| 9455353 | Substrate with multiple encapsulated devices | Gary Yama, Matthieu Liger, Andrew Graham | 2016-09-27 |
| 9400288 | Packaging system and process for inertial sensor modules using moving-gate transducers | Ando Feyh | 2016-07-26 |
| 9255000 | CMOS integrated moving-gate transducer with silicon as a functional layer | Ando Feyh, Markus Ulm | 2016-02-09 |
| 9236555 | Piezoelectric based MEMS structure | Ando Feyh, Gary O'Brien | 2016-01-12 |