Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449837 | 3D chip-on-wafer-on-substrate structure with via last process | Chen-Hua Yu, Ming-Fa Chen | 2016-09-20 |
WT
Wen-Ching Tsai
Overall (2016): #187,269 of 481,213Top 40%
1
Patents 2016